Method for fabricating touch panel

ABSTRACT

A method for fabricating a touch panel includes: providing a silver nano wire layer; providing first organic patterns and second organic patterns on the silver nano wire layer; providing a metal layer on the first organic patterns and the second organic patterns; forming a first bridge layer, first sensing electrodes, and second sensing electrodes by etching the metal layer and the silver nano wire layer; providing a transparent conductive oxide layer on the first organic patterns, the second organic patterns, the first bridge layer, the first sensing electrodes, and the second sensing electrodes; and forming a second bridge layer by etching the transparent conductive oxide layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Division of U.S. patent application Ser. No.15/468,076, filed Mar. 23, 2017, which claims priority from and thebenefit of Korean Patent Application No. 10-2016-0035466, filed on Mar.24, 2016, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

Exemplary embodiments relate to a touch panel and a method forfabricating the same, and more particularly, to a touch panel having asimplified fabrication process and improved reliability, and a methodfor fabricating the same.

Discussion of the Background

A touch panel is an input unit through which a user may contact an itemdisplayed on an image display device with the user's hand or an objectto input a user's command. The touch panel is disposed on a frontsurface of the image display device to convert a position information ofthe directly or indirectly contact of the person's hand or the objectinto an electrical signal. The item displayed at the contact positionmay be received as an input signal.

The touch panel may have wide range of applications since the touchpanel may be connected to a display panel to substitute for other inputunits, such as a keyboard and a mouse. The touch panel may include aresistive overlay touch panel, a photosensitive touch panel, and acapacitive touch panel according to an implementation method thereof.With the capacitive touch panel, when the user or the object directly orindirectly contacts the capacitive touch panel, the conductive sensingelectrode may sense a change in capacitance generated between aconductive sensing electrode and the adjacent sensing electrode orground electrode to convert the contact position information into anelectrical signal.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

The present disclosure provides a touch panel that has improvedreliability and can be manufactured in a simplified manner.

The present disclosure provides a method for fabricating a touch panelwith improved reliability in a process that simplifies fabrication.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concepts.

According to an exemplary embodiment, a touch panel may include: firstsensing electrodes arranged spaced apart from each other in a firstdirection and a second direction crossing the first direction, each ofthe first sensing electrodes including a silver nano wire; secondsensing electrodes arranged spaced apart from the first sensingelectrodes and arranged spaced apart from each other in the first andsecond directions, each of the second sensing electrodes including asilver nano wire; first organic patterns disposed on the first sensingelectrodes, each of the first organic patterns including at least onecontact hole; second organic patterns disposed on the second sensingelectrodes; and bridges respectively connecting two first sensingelectrodes adjacent in the first direction, the bridges disposed on aportion of each of the two first sensing electrodes and contacting thetwo first sensing electrodes through the contact holes, wherein each ofthe bridges includes: a first bridge layer including a metal, the firstbridge layer overlapping the contact hole; and a second bridge layerincluding a transparent conductive oxide, the second bridge layerpartially overlapping the first bridge layer, disposed on the firstbridge layer and the first organic patterns, and not overlapping thesecond organic patterns.

The first organic patterns may not overlap the second organic patternsin a planar view.

The touch panel may further include connection parts respectivelyconnecting two second sensing electrodes adjacent in the seconddirection, the connection parts may be integrated with the secondsensing electrodes.

The touch panel may further include third organic patterns respectivelydisposed on the connection parts, the third organic patterns may beintegrated with the second organic patterns.

The second bridge layer may be disposed on the first bridge layer, thefirst organic patterns, and the third organic patterns, and the secondbridge layer may not overlap with the second organic patterns.

Each of the first sensing electrodes may include: a first sensing partincluding the silver nano wire; and a first non-sensing part may be freeof the silver nano wire, the first non-sensing part connected to thefirst sensing part.

The first non-sensing part may surround the first sensing part in aplanar view.

Each of the second sensing electrodes may include: a second sensing partincluding the silver nano wire; and a second non-sensing part may befree of the silver nano wire, the second non-sensing part connected tothe second sensing part.

The second non-sensing part may surround the second sensing part in aplanar view.

The first bridge layer may overlap a portion of each of the firstsensing electrodes, and may not overlap with the second sensingelectrodes and the connection parts in a planar view.

The first bridge layer may overlap a portion of each of the firstorganic patterns, and may not overlap with the second organic patternsand the third organic patterns in a planar view.

The second bridge layer may include: a first bridge part overlapping thefirst bridge layer; and a second bridge part connected to the firstbridge part, the second bride part may not overlap with the first bridgelayer.

The second bridge part may contact the first bridge part, the firstorganic patterns, and the third organic patterns.

According to an exemplary embodiment, a method for fabricating a touchpanel may include: providing a silver nano wire layer; providing firstorganic patterns and second organic patterns on the silver nano wirelayer; providing a metal layer on the first organic patterns and thesecond organic patterns; forming a first bridge layer, first sensingelectrodes, and second sensing electrodes by etching the metal layer andthe silver nano wire layer; providing a transparent conductive oxidelayer on the first organic patterns, the second organic patterns, thefirst bridge layer, the first sensing electrodes, and the second sensingelectrodes; and forming a second bridge layer by etching the transparentconductive oxide layer.

The metal layer and the silver nano wire layer may be etched through asingle etching process.

The providing of the first organic patterns and the second organicpatterns may include: providing an organic layer; providing a firstphotoresist layer on the organic layer; etching the first photoresistlayer using a first mask to form first photoresist patterns; and etchingthe organic layer using the first photoresist patterns as a mask to formthe first organic patterns and the second organic patterns.

The forming of the first bridge layer, the first sensing electrodes, andthe second sensing electrodes may include: providing a secondphotoresist layer on the metal layer; etching the second photoresistlayer using a second mask to form second photoresist patterns; andetching the metal layer and the transparent conductive oxide layer usingthe second photoresist patterns as a mask to form the first bridgelayer, the first sensing electrodes, and the second sensing electrodes.

The forming of the second bridge layer may include: providing a thirdphotoresist layer on the transparent conductive oxide layer; etching thethird photoresist layer using a third mask to form third photoresistpatterns; and etching the transparent conductive oxide layer using thethird photoresist patterns as a mask to form the second bridge layer.

In the forming of the first bridge layer, the first sensing electrodes,and the second sensing electrodes, each of the first sensing electrodesmay correspond to each of the first organic patterns, and each of thesecond sensing electrodes may correspond to each of the second organicpatterns.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1 is a schematic plan view of a touch panel according to anexemplary embodiment.

FIG. 2A is a schematic cross-sectional view taken along a sectional lineI-I′ of FIG. 1.

FIG. 2B is a schematic cross-sectional view taken along a sectional lineII-II′ of FIG. 1.

FIG. 2C is a schematic cross-sectional view taken along a sectional lineIII-III′ of FIG. 1.

FIG. 3A is a schematic cross-sectional view of first sensing electrodesaccording to an exemplary embodiment.

FIG. 3B is a schematic cross-sectional view of second sensing electrodesaccording to an exemplary embodiment.

FIG. 4 is a schematic flowchart illustrating a method for fabricating atouch panel according to an exemplary embodiment.

FIGS. 5A, 5B, 5C, 5D, 5E, 5F, 5G, 5H, 5I, 5J, 5K, 5L, and 5M areschematic cross-sectional views sequentially illustrating the method forfabricating the touch panel according to an exemplary embodiment.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. As such, the regions illustrated in the drawings areschematic in nature and their shapes are not intended to illustrate theactual shape of a region of a device and are not intended to belimiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a schematic plan view of a touch panel according to anexemplary embodiment.

Referring to FIG. 1, a touch panel 10 according to an exemplaryembodiment may recognize at least one of; a direct touch of a user, anindirect touch of the user, a direct touch of an object, and an indirecttouch of the object. The direct touch may refer to the user or theobject directly contacting the touch panel 10. The indirect touch mayrefer to the touch panel 10 recognizing the user or the objectpositioned in proximity at a distance that are not directly touching thetouch panel 10.

The touch panel 10 according to an exemplary embodiment may be appliedto display devices including a liquid crystal display (LCD) panel, afield emission display (FED) panel, a plasma display panel (PDP), and anorganic electroluminescence device (EL). Here, the touch panel 10according to an exemplary embodiment may be connected to a display panelby using an adhesive or an adhesive agent or continuously connected tothe display panel by using the uppermost layer of the display panel (forexample, an encapsulation layer for protecting an organic layerincluding a light emitting layer in an organic field emission displaypanel) as a base layer BL.

The touch panel 10 according to an exemplary embodiment includes a baselayer BL, first sending units, second sensing units, a pad unit PAD, andan outer line OL. A sensing electrode TE includes first sensingelectrodes Tx and second sensing electrodes Rx.

The first sensing units extend in a first direction DR1 and are disposedspaced apart from each other in a second direction DR2. The firstsensing units include the first sensing electrodes Tx and bridges BD.

The second sensing units extend in the second direction DR2 and arespaced apart from each other in the first direction DR1. The secondsensing units include the second sensing electrodes Rx and connectionparts CN.

External touch may be inputted through the base layer BL. The base layerBL may transmit light therethrough and have the form of a transparentconductive film. The exemplary embodiments are not specifically limited,and any material that may be commonly used to form the base layer BL maybe included. For example, the base layer BL may include at least one ofplastic, glass, a polymer, an organic compound, and an inorganiccompound. The base layer BL may have a plate shape. Also, the base layerBL may be a thin film encapsulation layer for protecting an organiclayer including a light emitting layer and be provided as a separatesubstrate in an organic electroluminescent device.

The base layer BL includes a touch non-recognition area NTA and a touchrecognition area TA. The touch non-recognition area NTA does notrecognize external touch. For example, the touch non-recognition areaNTA may surround the touch recognition area TA. The touch recognitionarea TA recognizes the external touch. The touch recognition area TA mayhave a substantially rectangular shape, but the exemplary embodimentsare not limited thereto.

A pad unit PAD and the outer line OL may be disposed on the touchnon-recognition area NTA. Referring to FIG. 1, the pad unit PAD isdisposed at a left side of the touch recognition area TA, but theexemplary embodiments are not limited thereto. For example, the pad unitPAD may be disposed at various positions such as right, upper, and lowersides of the touch recognition area TA in the planar view.

The pad unit PAD is electrically connected to the sensing electrode TE.The pad unit PAD is disposed on the base layer BL. The pad unit PAD mayinclude first pad units PAD1 and second pad units PAD2.

The first pad units PAD1 are electrically connected to the first sensingelectrodes Tx. The first pad units PAD1 may be electrically connected tothe first sensing electrode Tx disposed on one end of each rows of thefirst sensing electrodes Tx extending in the first direction DR1.Referring to FIG. 1, the first pad units PAD1 are electrically connectedto the first sensing electrode Tx, disposed on one end of each rows ofthe first sensing electrodes Tx extending in the first direction DR1,but the exemplary embodiments are not limited thereto. For example, thefirst pad units PAD1 may be electrically connected to the first sensingelectrodes Tx disposed on both ends of each rows of the first sensingelectrodes Tx extending in the first direction DR1.

The second pad units PAD2 are electrically connected to the secondsensing electrodes Rx. The second pad units PAD2 may be electricallyconnected to the second sensing electrode Rx disposed on one end of eachcolumns of the second sensing electrodes Rx extending in the seconddirection DR2. Referring to FIG. 1, the second pad units PAD2 areelectrically connected to the second sensing electrode Rx, disposed onone end of each columns of the second sensing electrodes Rx extending inthe second direction DR2, but the exemplary embodiments are not limitedthereto. For example, the second pad units PAD2 may be electricallyconnected to the second sensing electrodes Rx disposed on both ends ofeach columns of the second sensing electrodes Rx extending in the seconddirection DR2.

The outer line OL connects the sensing electrode TE to the pad unit PAD.The outer line OL is disposed on the base layer BL. The outer line OLmay include first outer lines OL1 and second outer lines OL2.

The first outer lines OL1 connect the first sensing electrodes Tx to thefirst pad units PAD1. The first sensing electrode Tx disposed on one endof each rows of the first sensing electrodes Tx extending in the firstdirection DR1 is connected to the first outer lines OL1 and electricallyconnected to the first pad units PAD1. Referring to FIG. 1, the firstsensing electrode Tx disposed on one end of each rows of the firstsensing electrodes Tx extending in the first direction DR1 is connectedto the first outer lines OL1 and electrically connected to the first padunits PAD1, the exemplary embodiments are not limited thereto. Forexample, the first sensing electrodes Tx disposed on both ends of eachrows of the first sensing electrodes Tx extending in the first directionDR1 may be connected to the first outer lines OL1 and electricallyconnected to the first pad units PAD1.

The second outer lines OL2 connect the second sensing electrodes Rx tothe second pad units PAD2. The second sensing electrode Rx disposed onone end of each columns of the second sensing electrodes Rx extending inthe second direction DR2 is connected to the second outer lines OL2 andelectrically connected to the second pad units PAD2. Referring to FIG.1, the second sensing electrode Rx, disposed on one end of each columnsof the second sensing electrodes Rx extending in the second directionDR2 is connected to the second outer lines OL2 and electricallyconnected to the second pad units PAD2, the exemplary embodiments arenot limited thereto. For example, the second sensing electrodes Rxdisposed on both ends of the second sensing electrodes Rx extending inthe second direction DR2 may be connected to the second outer lines OL2and electrically connected to the second pad units PAD2.

The sensing electrode TE may be disposed on the touch recognition areaTA. First sensing units and second sensing units may be disposed on thetouch recognition area TA. An input of the external touch by the sensingelectrode TE is recognized on the touch recognition area TA. When theexternal touch is applied by the touch by the hand or object, acapacitance between the sensing electrodes TE, e.g., the first sensingelectrodes Tx and the second sensing electrodes Rx of the sensingelectrode TE may change. According to the change of the capacitance, asensing signal applied to the first sensing electrodes Tx may be delayedand transmitted to the second sensing electrodes Rx. The touch panel 10may sense touch coordinates from the delay in the sensing signal.

FIG. 2A is a schematic cross-sectional view taken along a sectional lineI-I′ of FIG. 1. FIG. 2B is a schematic cross-sectional view taken alonga sectional line II-II′ of FIG. 1. FIG. 2C is a schematiccross-sectional view taken along a sectional line III-III′ of FIG. 1.FIG. 3A is a schematic cross-sectional view of the first sensingelectrodes according to an exemplary embodiment. FIG. 3B is a schematiccross-sectional view of the second sensing electrodes according to anexemplary embodiment.

Referring to FIGS. 1, 2A, 2B, and 2C, the sensing electrode TE isdisposed in the form of a matrix having a plurality of rows extending inthe first direction DR1 and a plurality of columns extending in thesecond direction DR2. The sensing electrode TE includes first sensingelectrodes Tx and second sensing electrodes Rx. The first sensingelectrodes Tx and the second sensing electrodes Rx may be electricallyinsulated from each other. Each of the first sensing electrodes Tx andthe second sensing electrodes Rx may have various shapes such as adiamond shape, a square shape, a rectangular shape, a circular shape, oran irregular shape (e.g., a shape in which tree branches are interlacedsuch as a dendrite structure).

The first sensing electrodes Tx are arranged to be spaced apart fromeach other in the first direction DR1 and the second direction DR2crossing the first direction DR1. The first sensing electrodes Tx spacedapart from each other in the first direction DR1 are connected to eachother by the bridges BD.

Each of the first sensing electrodes Tx includes a resin layer RL and asilver nano wire NW included in the resin layer RL. Each of the firstsensing electrodes Tx includes a first sensing part SP1 and a firstnon-sensing part NSP1. The first sensing part SP1 includes the silvernano wire NW. The first non-sensing part NSP1 is connected to the firstsensing part SP1. The first non-sensing part NSP1 does not include thesilver nano wire NW. That is, the first non-sensing part NSP1 iscomposed of the resin layer RL. Referring to FIG. 3A, the firstnon-sensing part NSP1 may surround the first sensing part SP1 in theplanar view. Referring to FIG. 3A, the first sensing part SP1 may have adiamond shape in the planar view, and the first non-sensing part NSP1may have a diamond ring shape in the planar view surrounding the firstsensing part SP1.

Referring again to FIGS. 1, 2A, 2B, and 2C, the second sensingelectrodes Rx are arranged to be spaced apart from each other in thefirst direction DR1 and the second direction DR2. The second sensingelectrodes Tx spaced apart from each other in the second direction DR2are connected to each other by the connection parts CN.

Each of the second sensing electrodes Rx includes a resin layer RL and asilver nano wire NW included in the resin layer RL. Each of the secondsensing electrodes Rx includes a second sensing part SP2 and a secondnon-sensing part NSP2. The second sensing part SP2 includes the silvernano wire NW. The second non-sensing part NSP2 is connected to thesecond sensing part SP2. The second non-sensing part NSP2 does notinclude the silver nano wire NW. That is, the second non-sensing partNSP2 is composed of the resin layer RL. Referring to FIG. 3B, the secondnon-sensing part NSP2 may surround the second sensing part SP2 in theplanar view. Referring to FIG. 3B, the second sensing part SP2 may havea diamond shape in the planar view, and the second non-sensing part NSP2may have a diamond ring shape in the planar view surrounding the secondsensing part SP2.

Referring again to FIGS. 1, and 2A, 2B, 2C, the bridges BD connect thefirst sensing electrodes Tx spaced apart from each other in the firstdirection DR1 to each other. The first sensing electrodes Tx spacedapart from each other in the first direction DR1 may transmit andreceive a signal therebetween by the bridges BD.

Each of the bridges BD connects two adjacent first sensing electrodes Txspaced apart from each other in the first direction DR1. The term“adjacent to each other” may mean a state in which a distancetherebetween is minimized.

Each of the bridges BD includes a first bridge layer BDL1 and a secondbridge layer BDL2. The first bridge layer BDL1 overlaps a contact holeCH. The first bridge layer BDL1 includes a metal. The exemplaryembodiments are not specifically limited thereto, and any material thatmay be commonly used to form the first bridge layer BDL1 may beincluded. For example, the bridge BD may include at least one of Al, Cu,Ti, Ag, Au, Pt, Mo, a silver palladium copper alloy (APC) and a silverpalladium alloy (AP). The first bridge layer BDL1 may be formed throughthe same process of forming the first and second sensing electrodes Txand Rx.

The first bridge layer BDL1 provided to correspond to the second bridgelayer BDL2 may be visible to the user because the first bridge layerBDL1 includes an opaque metal. According to the exemplary embodiments,the touch panel may reduce a resistance value of the bridges BD byproviding the first bridge layer BDL1 including a metal having lowresistance compared to only providing the second bridge layer BDL2having high resistance. Also, use of the first bridge layer BDL1 may bereduced or minimized, so the part of the bridges BD visible to the usermay be reduced or minimized.

The first bridge layer BDL1 overlaps a portion of each of the firstsensing electrodes Tx in planar view. The first bridge layer BDL1 isspaced apart from each of the second sensing electrodes Rx in the planarview. The first bridge layer BDL1 is spaced apart from the connectionparts CN in planar view.

The first bridge layer BDL1 overlaps a portion of each of first organicpatterns OP1 in the planar view. The first bridge layer BDL1 is spacedapart from each of second organic patterns OP2 in the planar view. Thefirst bridge layer BDL1 is spaced apart from third organic patterns OP3in the planar view.

A portion of the second bridge layer BDL2 overlaps the first bridgelayer BDL1. The second bridge layer BDL2 is disposed on the first bridgelayer BDL1 and the first organic patterns OP1. The second bridge layerBDL2 is disposed on the first bridge layer BDL1, the first organicpatterns OP1, and the third organic patterns OP3. The second bridgelayer BDL2 overlaps a portion of each of the first sensing electrodesTx. The second bridge layer BDL2 overlaps a portion of each of the firstsensing electrodes Tx in the planar view. The second bridge layer BDL2is spaced apart from the second sensing electrodes Rx. The second bridgelayer BDL2 is spaced apart from the second sensing electrodes Rx in theplanar view. The second bridge layer BDL2 overlaps the connection partsCN. The second bridge layer BDL2 overlaps at least a portion of theconnection parts CN in the planar view.

The second bridge layer BDL2 includes transparent conductive oxide. Theexemplary embodiments are not specifically limited thereto, and anytransparent conductive oxide commonly used to form the second bridgelayer BDL2 may be used. For example, the transparent conductive oxidemay include at least one of indium tin oxide (ITO), indium zinc oxide(IZO), and indium gallium zinc oxide (IGZO).

The second bridge layer BDL2 includes a first bridge part BDLP1 and asecond bridge part BDLP2. The first bridge part BDLP1 overlaps the firstbridge layer BDL1. The first bridge part BDLP1 corresponds to the firstbridge layer BDL1. The first bridge part BDLP1 is disposed on the firstbridge layer BDL1. The first bridge part BDLP1 overlaps a portion ofeach of the first organic patterns OP1. The first bridge part BDLP1overlaps a portion of each of the first organic patterns OP1 in theplanar view. The first bridge layer BDLP1 overlaps a portion of each ofthe first sensing electrodes Tx. The first bridge layer BDLP1 overlaps aportion of each of the first sensing electrodes Tx in the planar view.The first bridge part BDLP1 is spaced apart form the second organicpatterns OP2. The first bridge part BDLP1 is spaced apart form thesecond organic patterns OP2 in the planar view. The first bridge partBDLP1 is spaced apart from the second sensing electrodes Rx. The firstbridge part BDLP1 is spaced apart from the second sensing electrodes Rxin the planar view. The first bridge part BDLP1 is spaced apart form thethird organic patterns OP3. The first bridge part BDLP1 is spaced apartform the third organic patterns OP3 in the planar view. The first bridgepart BLDP1 is spaced apart from the connection parts CN. The firstbridge part BLDP1 is spaced apart from the connection parts CN in theplanar view.

The second bridge part BDLP2 is connected to the first bridge partBDLP1. The second bridge part BDLP2 is integrated with the first bridgepart BDLP1. The second bridge part BDLP2 does not overlap the firstbridge layer BDL1. The second bridge part BDLP2 does not overlap thefirst bridge layer BDL1 in the planar view. The second bridge part BDLP2overlaps a portion of each of the first organic patterns OP1. The secondbridge part BDLP2 overlaps a portion of each of the first organicpatterns OP1 in the planar view. The second bridge layer BDLP2 overlapsa portion of each of the first sensing electrodes Tx. The second bridgelayer BDLP2 overlaps a portion of each of the first sensing electrodesTx in the planar view. The second bridge part BDLP2 is spaced apart formthe second organic patterns OP2. The second bridge part BDLP2 is spacedapart form the second organic patterns OP2 in the planar view. Thesecond bridge part BDLP2 is spaced apart from the second sensingelectrodes Rx. The second bridge part BDLP2 is spaced apart from thesecond sensing electrodes Rx in the planar view. The second bridge partBDLP2 overlaps the third organic patterns OP3. The second bridge partBDLP2 overlaps the third organic patterns OP3 in the planar view. Thesecond bridge part BLDP2 overlaps the connection parts CN. The secondbridge part BLDP2 overlaps the connection parts CN in the planar view.

The connection parts CN connect the second sensing electrodes Rx spacedapart from each other in the second direction DR2. The second sensingelectrodes Rx spaced apart from each other in the second direction DR2may transmit and receive a signal through the connection parts CN. Eachof the connection parts CN connects two adjacent second sensingelectrodes Rx spaced apart from each other in the second direction DR2.Each of the connection parts CN is integrated with the second sensingelectrodes Rx. Each of the connection parts CN includes a resin layer RLand a silver nano wire NW included in the resin layer RL.

Each of the connection parts CN includes a first sub connection partCNP1 and a second sub connection part CNP2. The first sub connectionpart CNP1 includes a resin layer RL and a silver nano wire NW in theresin layer RL. The second sub connection part CNP2 is connected to thefirst sub connection part CNP1. The second sub connection part CNP2 doesnot include the silver nano wire NW. The second sub connection part CNP2is composed of the resin layer RL.

The touch panel 10 according to an exemplary embodiment includes thefirst organic patterns OP1, the second organic patterns OP2, and thethird organic patterns OP3. The first organic patterns OP1, the secondorganic patterns OP2, and the third organic patterns OP3 may be disposedthrough the same process. Each of the first, second, and third organicpatterns OP1, OP2, and OP3 may include polyethylene terephthalate (PET),polyethylene naphthalate (PEN), polyimide, or polyether sulfone.

The first organic patterns OP1 are disposed on the first sensingelectrodes Tx, respectively. The first organic patterns OP1 correspondto the first sensing electrodes Tx, respectively. Each of the firstorganic patterns OP1 includes at least one contact hole CH. The firstorganic patterns OP1 overlap the first sensing electrodes Tx,respectively. The first organic patterns OP1 overlap the first sensingelectrodes Tx in the planar view, respectively. The first organicpatterns OP1 are spaced apart from the second organic patterns OP2. Thefirst organic patterns OP1 are spaced apart from the second organicpatterns OP2 in the planar view. The first organic patterns OP1 arespaced apart from the third organic patterns OP3. The first organicpatterns OP1 are spaced apart from the third organic patterns OP3 in theplanar view.

The second organic patterns OP2 are disposed on the second sensingelectrodes Rx, respectively. The second organic patterns OP2 correspondto the second sensing electrodes Rx, respectively. The second organicpatterns OP2 overlap the second sensing electrodes Rx, respectively. Thesecond organic patterns OP2 overlap the second sensing electrodes Rx inthe planar view, respectively.

The third organic patterns OP3 are disposed on the connection parts CN,respectively. The third organic patterns OP3 correspond to theconnection parts CN, respectively. The third organic patterns OP1 areintegrated with the second organic patterns OP2. The third organicpatterns OP3 overlap the connection parts CN, respectively. The thirdorganic patterns OP3 overlap the connection parts CN in the planar view,respectively.

A conventional touch panel does not generally include first organicpatterns, second organic patterns, and third organic patterns. When thefirst organic patterns, the second organic patterns, and the thirdorganic patterns are not included in the touch panel, the silver nanowire provided in the first sensing electrodes, the second sensingelectrodes, and the connection parts may be inadvertently etched whileforming the bridges by etching a metal layer.

The touch panel according to an exemplary embodiment includes the firstorganic patterns disposed on the first sensing electrodes, the secondorganic patterns disposed on the second sensing electrodes, and thethird organic patterns disposed on the connection parts. Thus, damage tothe first sensing electrodes, the second sensing electrodes, and theconnection parts while forming the bridges may be prevented or reduced.Therefore, the touch panel according to an exemplary embodiment may haveimproved touch reliability compared to the conventional touch panel.

Hereinafter, a method for fabricating the touch panel according to anexemplary embodiment will be described. Hereinafter, the method forfabricating the touch panel according to an exemplary embodiment coversdescriptions not proffered respect to the touch panel according to theexemplary embodiments illustrated in FIGS. 1, 2A, 2B, 2C, 3A, and 3B,and substantially identical descriptions may be omitted or referred backto the proffered disclosure.

FIG. 4 is a schematic flowchart illustrating a method for fabricatingthe touch panel according to an exemplary embodiment. FIGS. 5A, 5B, 5C,5D, 5E, 5F, 5G, 5H, 5I, 5J, 5K, 5L, and 5M are schematic cross-sectionalviews sequentially illustrating the method for fabricating the touchpanel according to an exemplary embodiment.

Referring to FIGS. 1, 2A, 2B, 2C, and 4, a method for fabricating thetouch panel 10 according to an exemplary embodiment includes providing asilver nano wire layer NWL (S100), providing first organic patterns OP1and second organic patterns OP2 on the silver nano wire layer NWL(S200), providing a metal layer ML on the first and second organicpatterns OP1 and OP2 (S300), etching the metal layer ML and the silvernano wire layer NWL to form a first bridge layer BDL1, first sensingelectrodes Tx, and second sensing electrodes Rx (S400), providing atransparent conductive oxide layer TCOL on the first organic patternsOP1, the second organic patterns OP2, the first bridge layer BDL1, thefirst sensing electrodes Tx, and the second sensing electrodes Rx(S500), and etching the transparent conductive oxide layer TCOL to formsecond bridge layer BDL2 (S600).

Referring to FIGS. 4 and 5A, the silver nano wire layer NWL is disposedon a base layer BL (S100). The base layer BL may be a transmissive baselayer and be a transparent conductive film. The exemplary embodimentsare not specifically limited thereto, and any material that may becommonly used to form the base layer BL may be included. For example,the base layer BL may include at least one of plastic, glass, a polymer,an organic compound, and an inorganic compound. The base layer BL mayhave a plate shape. Also, the base layer BL may be a thin filmencapsulation layer for protecting an organic layer including a lightemitting layer and be provided as a separate substrate in an organicelectroluminescent device.

The silver nano wire layer NWL includes a resin layer RL and a silvernano wire NW in the resin layer RL. The silver nano wire layer NWL isdisposed on an entire surface of the base layer BL.

Referring to FIGS. 4 and 5B, 5C, 5D, and 5E, providing the first andsecond organic patterns OP1 and OP2 (S200) may include; providing anorganic layer ORL, providing a first photoresist layer PRL1 on theorganic layer ORL, forming the first photoresist patterns PRP1 byetching the first photoresist layer PRL1 using a first mask MSK1, andforming the first and second organic patterns OP1 and OP2 by etching theorganic layer ORL using the first photoresist patterns PRP1.

Referring to FIGS. 4 and 5B, the organic layer ORL is disposed on thesilver nano wire layer NWL. The exemplary embodiments are not limited,and any material that may be commonly used to form the organic layer ORLmay be included. For example, the organic layer ORL may include anorganic insulation material. For example, the organic layer ORL mayinclude at least one of polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polyimide, and polyether sulfone.

Referring to FIGS. 4 and 5C, the first photoresist layer PRL1 isdisposed on the organic layer ORL. The first photoresist layer PRL1 mayinclude photoresist material. The first mask MSK1 is disposed on thephotoresist layer.

Referring to FIGS. 4 and 5D, the first photoresist layer PRL1 is exposedand developed using the first mask MSK1 to form the first photoresistpatterns PRP1. The first photoresist patterns PRP1 is disposed on theorganic layer ORL.

Referring to FIGS. 4 and 5E, the first organic patterns OP1, the secondorganic patterns OP2, and the third organic patterns OP3 are formed byusing the first photoresist patterns PRP1 as a mask. The first organicpatterns OP1, the second organic patterns OP2, and the third organicpatterns OP3 are formed, and then, the first photoresist patterns PRP1are removed.

Referring to FIGS. 4 and 5 f, a metal layer ML is disposed on the firstand second organic patterns OP1 and OP2 (S300). The metal layer ML isalso disposed on the third organic patterns OP3. The metal layer ML isdisposed on the entire upper surface. The exemplary embodiments are notspecifically limited, and any material that may be commonly used to formmetal layer ML may be included. For example, the bridge BD may includeat least one of a silver palladium copper alloy (APC) and a silverpalladium alloy (AP).

Referring to FIGS. 4 and 5G, 5H, and 5I, forming the first bridge layerBDL1, the first sensing electrodes Tx, and the second sensing electrodesRx may include; providing a second photoresist layer PRL2 on the metallayer ML, etching the second photoresist layer PRL2 using a second maskMSK2 to form second photoresist patterns PRP2, and etching the metallayer ML and the transparent conductive oxide layer TCOL by using thesecond photoresist patterns PRP2 as a mask to form the first bridgelayer BDL1, the first sensing electrodes Tx, and the second sensingelectrodes Rx (S400).

Referring to FIGS. 4 and 5G, the second photoresist layer PRL2 isdisposed on the metal layer ML. The second photoresist layer PRL2 mayinclude photoresist material. The second mask MSK2 is disposed on thephotoresist layer.

Referring to FIGS. 4 and 5H, the second photoresist layer PRL2 isexposed and developed using the second mask MSK2 to form the secondphotoresist patterns PRP2. The second photoresist patterns PRP2 isdisposed on the metal layer ML.

Referring to FIGS. 4 and 5I, the metal layer ML and the silver nano wirelayer NWL is etched through a single etching process using the secondphotoresist patterns PRP2 to form the first bridge layer BDL1, the firstsensing electrodes Tx, and the second sensing electrodes Rx. The firstbridge layer BDL1, the first sensing electrodes Tx, the second sensingelectrodes Rx, and the connection parts CN are formed by using thesecond photoresist patterns PRP2 as a mask. The first bridge layer BDL1,the first sensing electrodes Tx, and the second sensing electrodes Rxare formed, and, the second photoresist patterns PRP2 are removed.

Each of the first sensing electrodes Tx includes a resin layer RL and asilver nano wire NW included in the resin layer RL. Each of the firstsensing electrodes Tx includes a first sensing part SP1 and a firstnon-sensing part NSP1. The first sensing part SP1 includes the silvernano wire NW. The first non-sensing part NSP1 is connected to the firstsensing part SP1. The first non-sensing part NSP1 does not include thesilver nano wire NW. The silver nano wire NW in the first non-sensingpart NSP1 is removed during etching through the silver nano wire layerNWL to form the first sensing electrode Tx.

The first organic patterns OP1 are disposed on the first sensingelectrodes Tx, respectively. The first organic patterns OP1 correspondto the first sensing electrodes Tx, respectively. Each of the firstorganic patterns OP1 includes at least one contact hole CH. The firstorganic patterns OP1 overlap the first sensing electrodes Tx,respectively.

Each of the second sensing electrodes Rx includes a resin layer RL and asilver nano wire NW included in the resin layer RL. Each of the secondsensing electrodes Rx includes a second sensing part SP2 and a secondnon-sensing part NSP2. The second sensing part SP2 includes the silvernano wire NW. The second non-sensing part NSP2 is connected to thesecond sensing part SP2. The second non-sensing part NSP2 does notinclude the silver nano wire NW. The silver nano wire NW in the secondnon-sensing part NSP2 is removed during etching through the silver nanowire layer NWL to form the second sensing electrode Rx.

The second organic patterns OP2 are disposed on the second sensingelectrodes Rx, respectively. The second organic patterns OP2 correspondto the second sensing electrodes Rx, respectively. The second organicpatterns OP2 overlap the second sensing electrodes Rx, respectively.

The connection parts CN are integrated with the second sensingelectrodes Rx. Each of the connection parts CN includes a resin layer RLand a silver nano wire NW included in the resin layer RL. Each of theconnection parts CN includes a first sub connection part CNP1 and asecond sub connection part CNP2. The first sub connection part CNP1includes a resin layer RL and a silver nano wire NW in the resin layerRL. The second sub connection part CNP2 is connected to the first subconnection part CNP1. The second sub connection part CNP2 does notinclude the silver nano wire NW. The silver nano wire NW in the secondsub connection part CNP2 is removed during etching through the silvernano wire layer NWL to form the connection parts CN.

The third organic patterns OP3 are disposed on the connection parts CN,respectively. The third organic patterns OP3 correspond to theconnection parts CN, respectively. The third organic patterns OP1 areintegrated with the second organic patterns OP2. The third organicpatterns OP3 overlap the connection parts CN, respectively.

The first bridge layer BDL1 overlaps the contact holes CH provided inthe first organic patterns OP1. The first bridge layer BDL1 overlaps aportion of each of the first sensing electrodes Tx. The first bridgelayer BDL1 is spaced apart from each of the second sensing electrodesRx. The first bridge layer BDL1 is spaced apart from the connectionparts CN. The first bridge layer BDL1 overlaps a portion of each oforganic patterns OP1. The first bridge layer BDL1 is spaced apart fromthe second organic patterns OP2. The first bridge layer BDL1 is spacedapart from third organic patterns OP3.

Referring to FIGS. 4 and 5J, the transparent conductive oxide layer TCOLis disposed on the first organic patterns OP1, the second organicpatterns OP2, the first bridge layer BDL1, the first sensing electrodesTx, and the second sensing electrodes Tx (S500). The exemplaryembodiments are not specifically limited, and any material that may becommonly used to form the transparent conductive oxide layer TCOL may beincluded. For example, the transparent conductive oxide may include atleast one of indium tin oxide (ITO), indium zinc oxide (IZO), and indiumgallium zinc oxide (IGZO). The transparent conductive oxide layer TCOLis disposed on the entire upper surface.

Referring to FIGS. 4 and 5K, 5L, and 5M, forming the second bridge layerBDL2 may include; providing a third photoresist layer PRL3 on thetransparent conductive oxide layer TCOL, etching the third photoresistlayer PRL3 by using a third mask MSK3 to form third photoresist patternsPRP3, and etching the transparent conductive oxide layer TCOL by usingthe third photoresist patterns PRP3 as a mask to form the second bridgelayer BDL2 (S600).

Referring to FIGS. 4 and 5K, the third photoresist layer PRL3 isdisposed on the transparent conductive oxide layer TCOL. The thirdphotoresist layer PRL3 may include photoresist material. The third maskMSK3 is disposed on the photoresist layer.

Referring to FIGS. 4 and 5L, the third photoresist layer PRL3 is exposedand developed using the third mask MSK3 to form the third photoresistpatterns PRP3. The third photoresist patterns PRP3 is disposed on thetransparent conductive oxide layer TCOL.

Referring to FIGS. 4 and 5M, the transparent conductive oxide layer TCOLis etched by using the third photoresist patterns PRP3 as a mask to formthe second bridge layer BDL2. The second bridge layer BDL2 is formed,and then, the third photoresist patterns PRP3 are removed.

Each of the bridges BD includes a first bridge layer BDL1 and a secondbridge layer BDL2. A portion of the second bridge layer BDL2 overlapsthe first bridge layer BDL1. The second bridge layer BDL2 is disposed onthe first bridge layer BDL1 and the first organic patterns OP1. Thesecond bridge layer BDL2 is disposed on the first bridge layer BDL1, thefirst organic patterns OP1, and the third organic patterns OP3. Thesecond bridge layer BDL2 overlaps a portion of each of the first sensingelectrodes Tx. The second bridge layer BDL2 is spaced apart from thesecond sensing electrodes Rx. The second bridge layer BDL2 overlaps theconnection parts CN.

The second bridge layer BDL2 includes a first bridge part BDLP1 and asecond bridge part BDLP2. The first bridge part BDLP1 overlaps the firstbridge layer BDL1. The first bridge part BDLP1 corresponds to the firstbridge layer BDL1. The first bridge part BDLP1 is disposed on the firstbridge layer BDL1. The first bridge part BDLP1 overlaps a portion ofeach of the organic patterns OP1. The first bridge layer BDLP1 overlap aportion of each of the first sensing electrodes Tx. The first bridgepart BDLP1 is spaced apart form the second organic patterns OP2. Thefirst bridge part BDLP1 is spaced apart from the second sensingelectrodes Rx. The first bridge part BDLP1 is spaced apart form thethird organic patterns OP3. The first bridge part BLDP1 is spaced apartfrom the connection parts CN.

The second bridge part BDLP2 is connected to the first bridge partBDLP1. The second bridge part BDLP2 is integrated with the first bridgepart BDLP1. The second bridge part BDLP2 does not overlap the firstbridge layer BDL1. The second bridge part BDLP2 overlaps a portion ofeach of the first organic patterns OP1. The second bridge layer BDLP2overlap a portion of each of the first sensing electrodes Tx. The secondbridge part BDLP2 is spaced apart form the second organic patterns OP2.The second bridge part BDLP2 is spaced apart from the second sensingelectrodes Rx. The second bridge part BDLP2 overlaps the third organicpatterns OP3. The second bridge part BLDP2 overlaps the connection partsCN.

The touch panel fabricated by a conventional method for fabricating atouch panel does not generally include first organic patterns, secondorganic patterns, and third organic patterns. When the first organicpatterns, the second organic patterns, and the third organic patternsare not included in the touch panel, the silver nano wire provided inthe first sensing electrodes, the second sensing electrodes, and theconnection parts may together be etched when the metal provided in thebridges is etched.

The touch panel fabricated by the method for fabricating the touch panelaccording to the embodiment includes the first organic patterns disposedon the first sensing electrodes, the second organic patterns disposed onthe second sensing electrodes, and the third organic patterns disposedon the connection parts. Thus, the damage to the first sensingelectrodes, the second sensing electrodes, and the connection partswhile forming the bridges may be prevented or reduced. Therefore, thetouch panel fabricated by the method for fabricating the touch panelaccording to the exemplary embodiment may have improved touchreliability compared to the conventional touch panel fabricated by theconventional method for fabricating the touch panel.

Also, in the method for fabricating the touch panel according to theembodiment, the metal layer and the silver nano wire layer may be etchedthrough a single process to simplify the fabricating process.

According to the embodiment, the touch panel may have simplifiedfabrication process and improved reliability. According to theembodiment, the method of fabricating the touch panel may havesimplified fabrication process and improved reliability.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of thepresented claims and various obvious modifications and equivalentarrangements.

What is claimed is:
 1. A method for fabricating a touch panel, themethod comprising: providing a silver nano wire layer; providing firstorganic patterns and second organic patterns on the silver nano wirelayer; providing a metal layer on the first organic patterns and thesecond organic patterns; forming a first bridge layer, first sensingelectrodes, and second sensing electrodes by etching the metal layer andthe silver nano wire layer; providing a transparent conductive oxidelayer on the first organic patterns, the second organic patterns, thefirst bridge layer, the first sensing electrodes, and the second sensingelectrodes; and forming a second bridge layer by etching the transparentconductive oxide layer.
 2. The method of claim 1, wherein the metallayer and the silver nano wire layer are etched through a single etchingprocess.
 3. The method of claim 1, wherein the providing of the firstorganic patterns and the second organic patterns comprises: providing anorganic layer; providing a first photoresist layer on the organic layer;etching the first photoresist layer using a first mask to form firstphotoresist patterns; and etching the organic layer using the firstphotoresist patterns as a mask to form the first organic patterns andthe second organic patterns.
 4. The method of claim 1, wherein theforming of the first bridge layer, the first sensing electrodes, and thesecond sensing electrodes comprises: providing a second photoresistlayer on the metal layer; etching the second photoresist layer using asecond mask to form second photoresist patterns; and etching the metallayer and the transparent conductive oxide layer using the secondphotoresist patterns as a mask to form the first bridge layer, the firstsensing electrodes, and the second sensing electrodes.
 5. The method ofclaim 1, wherein the forming of the second bridge layer comprises:providing a third photoresist layer on the transparent conductive oxidelayer; etching the third photoresist layer using a third mask to formthird photoresist patterns; and etching the transparent conductive oxidelayer using the third photoresist patterns as a mask to form the secondbridge layer.
 6. The method of claim 1, wherein, in the forming of thefirst bridge layer, the first sensing electrodes, and the second sensingelectrodes, each of the first sensing electrodes corresponds to each ofthe first organic patterns, and each of the second sensing electrodescorresponds to each of the second organic patterns.